ترجمة وتحليل الكلمات عن طريق الذكاء الاصطناعي ChatGPT
في هذه الصفحة يمكنك الحصول على تحليل مفصل لكلمة أو عبارة باستخدام أفضل تقنيات الذكاء الاصطناعي المتوفرة اليوم:
- كيف يتم استخدام الكلمة في اللغة
- تردد الكلمة
- ما إذا كانت الكلمة تستخدم في كثير من الأحيان في اللغة المنطوقة أو المكتوبة
- خيارات الترجمة إلى الروسية أو الإسبانية، على التوالي
- أمثلة على استخدام الكلمة (عدة عبارات مع الترجمة)
- أصل الكلمة
%ما هو (من)٪ 1 - تعريف
![wire bond]] BGA package; this package has an Nvidia [[GeForce 256]] GPU](https://commons.wikimedia.org/wiki/Special:FilePath/NVIDIA@220nm@Fixed-pipline@NV10@GeForce 256@T5A3202220008 S1 Taiwan A DSC01376 (29588383793).jpg?width=200 "wire bond]] BGA package; this package has an Nvidia [[GeForce 256]] GPU")
 CPU-pins PNr°0295.jpg?width=200 "Closeup of the pins of a pin grid array")
![AM2+ socket]]](https://commons.wikimedia.org/wiki/Special:FilePath/AMD Phenom X4 9750 (Underside).JPG?width=200 "AM2+ socket]]")
![Underside of a [[Pentium 4]] in a PGA package](https://commons.wikimedia.org/wiki/Special:FilePath/Pentium 4 Underside Demonstrating PGA Socket.JPG?width=200 "Underside of a [[Pentium 4]] in a PGA package")
![The topside of a [[Celeron]]-400 in a PPGA packing](https://commons.wikimedia.org/wiki/Special:FilePath/UpSL3A2.JPG?width=200 "The topside of a [[Celeron]]-400 in a PPGA packing")
![A 1.2 GHz [[VIA C3]] microprocessor in a ceramic package](https://commons.wikimedia.org/wiki/Special:FilePath/VIA C3 C5XL CPGA.jpg?width=200 "A 1.2 GHz [[VIA C3]] microprocessor in a ceramic package")
![The underside of a [[Celeron]]-400 in a PPGA](https://commons.wikimedia.org/wiki/Special:FilePath/SL3A2down.JPG?width=200 "The underside of a [[Celeron]]-400 in a PPGA")
ويكيبيديا
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
BGAs were introduced in the 1990s and became popular by 2001.
Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens.
